layer)에 형성된 수 m 이하의 두께를
갖는 것으로 독립적인 기능을 보유한 막.
ADVANTAGES OF THIN FILM
Complexibility and Accumulations
Easy processing
lm)
Easy Control of Thermal, Mechanical and Chemical Properties
Down the Cost of Production
High-Reliance
WHAT IS cvd?
Principle of cvd
High purity and quality deposition
Good economy and process control
A great
layer, it causes entire curve of graph to shift to the [Figure 12] C-V graph shift by direction of bias
side. These charges are generated by ions came in the process of deposition of oxide layer. When the charges exist in between the substrate and interface, the value of Vfb and C-V curve will shift by amount of the charge divided by Cox of Ci. The amount of shifting decreases as the position of
화학 기상 증착 (Low Pressure CVD, LPCVD)
플라즈마 향상 화학 기상 증착 (Plasma Enhanced CVD, PECVD)
대기압 화학 기상 증착 (Atmospheric Pressure CVD, APCVD)
-물리 기상 증착법(PVD)
금속의 증기를 사용하는 증발(evaporation) 증착법
물질에 물리적인 충격을 주는 방법인 Sputtering 증착법
-Atomic LayerDeposition(ALD)
The threshold voltage of a MOSFET is usually defined as the gate voltage where an inversion layer forms at the interface between the insulating layer (oxide) and the substrate (body) of the transistor. The purpose of the inversion layer's forming is to allow the flow of electrons through the gate-source junction. The voltage of oxide is given by
V_OX= 1/C_OX 2√(qN_A ε_Si V_0 )
SiO_2 V_O
General Process of 3D printing
FDM - Fused Deposition Molding
FDM works on an "additive" principle by laying down material in layers.
The model is produced by extruding small beads of thermoplastic material to form layers as the material hardens immediately after extrusion from the nozzle.
The nozzle can be moved in both horizontal and vertical directions by a numerically controlled mechanism
Layer
발광 다이오드, 즉 LED를 제작함에 있어 직접적으로 빛을 발하는 PN Junction의 설계와 제작이야말로 LED의 생명과 직결된다고 해도 과언이 아니다. 기존의 여타 조명기구인 백열등이나 형광등에 비해 몇 배에서 수십 배에 달하는 높은 효율을 자랑하는 LED라 할 지라도 기본적인 몇 가지 요소들을 갖
Making the Wafer
The process
-A seed crystal is suspended in a molten bath of silicon
-It is slowly pulled up and grows into an ingot of silicon
-The ingot is removed and ground down to diameter
-The end is cut off, then thin silicon wafers are sawn off (sliced) and polished
Epitaxy
The growth of an ultra-pure layer of crystalline silicon
Approx 3% of wafer thickness
Contaminant-free
deposition (PECVD) 방법 사용
1) 산소 플라즈마 처리 이후에 chamber을
5.0 x 10㎩ 이하로 둔다
2) tetramethylsilane (TMS, Si(CH₃)₄) 증기를
10㎩ 압력으로 gas inlet 으로 주입한다.
3) 200W로 10초간 방전하면
PET에 PECVD layer이 생성된다.
초 발수성
- 물에 대한 접촉각 150°, 기름에 대한 접촉각 120°까지
Overview
The printer that is widely used is 2D printer. 2D printer is operated with papers and ink. It can print the letters, shapes and colored pictures on the paper. However, 3D printer can make 3D structure with ink like polymer. 3D printers make the product with not the top-down method but the bottom-up method. The most useful advantage of 3D printer is that it is the more useful device wh
Lithography
Si Wafer coated with PR
Spin coating
PR is coated evenly by turning round rapidly.
Exposure
Align the Mask exactly and emit UV.(fixed 10sec)
Observation
See the completed sample through SEM
Development
∙ Dip the sample in the alkaline solution.
→(process parameter : 10sec 60sec 180sec)
∙ Due to differences in solubility of the exposed portion to be dissolv